| 发明名称 |
THERMOPLASTIC POLYIMIDE, LAMINATED BODY, AND SUBSTRATE FOR PRINTED WIRING BOARD |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermoplastic polyimide having excellent heat resistance and capable of securing excellent adhesiveness under a mitigated condition even when a thermoplastic polyimide layer is made thin. <P>SOLUTION: The thermoplastic polyimide has all structural units expressed by formula (1)-(3). In formula (2), R<SB POS="POST">1</SB>and R<SB POS="POST">2</SB>may be the same or different from each other and express a hydrogen atom or a 1C-4C alkyl group. In formula (3), R<SB POS="POST">3</SB>expresses a hydrogen atom or a 1C-4C alkyl group and R<SB POS="POST">4</SB>, R<SB POS="POST">5</SB>and R<SB POS="POST">6</SB>may be the same or different from each other and express a 2C-3C linear or branched alkylene group, and x, y, and z each express an average numerical value of 0-50 and the sum total of x+y+z is 2-70. <P>COPYRIGHT: (C)2012,JPO&INPIT |
| 申请公布号 |
JP2012140568(A) |
申请公布日期 |
2012.07.26 |
| 申请号 |
JP20110001212 |
申请日期 |
2011.01.06 |
| 申请人 |
MITSUBISHI CHEMICALS CORP;UNITIKA LTD |
发明人 |
TSUGE YOSUKE;HOSODA MASAHIRO;SHIGETA AKIRA;YOSHIDA TAKESHI |
| 分类号 |
C08G73/10;B32B15/08;B32B15/088;H05K1/03 |
主分类号 |
C08G73/10 |
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