发明名称 HEAT DISSIPATION SYSTEM
摘要 A heat dissipation system includes a base plate, a side plate perpendicularly to the base plate, a motherboard attached on the base plate, a first fan, and a second fan fixed on the side plate facing to the heat sink. The motherboard has a first heat source and a second heat source mounted thereon, a heat sink positioned on the first heat source, and a fan bracket mounted on the heat sink. The first fan is positioned on the fan bracket. A rotating axis of the first fan is perpendicular to that of the second fan.
申请公布号 US2012188716(A1) 申请公布日期 2012.07.26
申请号 US201113186760 申请日期 2011.07.20
申请人 WANG RUI;YAO ZHI-JIANG;XU LI-FU;HON HAI PRECISION INDUSTRY CO., LTD.;HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD. 发明人 WANG RUI;YAO ZHI-JIANG;XU LI-FU
分类号 H05K7/20 主分类号 H05K7/20
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