PREPREG, AND LAMINATE BOARD AND PRINTED WIRING BOARD USING SAME

摘要

A prepreg including a fiber base material and a thermosetting resin composition layer, characterized in that the thermosetting resin composition layer contains a compound having a modified silicone oil or a skeleton derived from a modified silicone oil and in that said thermosetting resin composition layer has a phase separation structure. The present invention is capable of providing a prepreg having low heat expansion and excellent warping characteristics which are difficult to achieve through only conventional methods such as high filling with an inorganic filler material or use of a resin with a low thermal expansion coefficient; the present invention is also capable of providing a laminate board and a printed wiring board using said prepreg.