RESIN COMPOSITION, CURED OBJECT, RESIN FILM, AND WIRING BOARD

摘要

Provided is a resin composition with which cure warpage can be mitigated and which has excellent heat resistance and is suitable for use as a material for the surface-protective film or interlayer dielectric of a semiconductor element or for a protective dielectric, interlayer dielectric, or the like for printed wiring boards. Also provided are a resin film obtained using the resin composition and a wiring board obtained using the composition or film. This resin composition is characterized by comprising (A) a polymer, (B) a polyfunctional hydroxylated compound having two or more hydroxy groups, and (C) a polyfunctional crosslinking compound having two or more crosslinking functional groups which form crosslinks between the crosslinking compound and the polymer and/or polyfunctional hydroxylated compound, the polyfunctional crosslinking compound being capable of forming three-dimensional crosslinks between the crosslinking compound and the polymer and/or polyfunctional hydroxylated compound.