| 摘要 |
Disclosed is a lighting device (3) including light-emitting diodes (light source) (23) and an LED substrate (circuit substrate) (22) provided with the light-emitting diodes (23). The lighting device (3) includes a heat-dissipation plate (heat-dissipation member) (25) that dissipates heat from the light-emitting diodes (23). The LED substrate (circuit substrate) (22) includes a mount portion (22a) on which the light-emitting diodes (23) are mounted, and first and second heat-transfer portions (22b1, 22b2) that are provided continuously to the mount portion (22a) and that transfer heat from the light-emitting diodes (23). In the LED substrate (22), the first and second heat-transfer portions (22b1, 22b2) are attached to be in close contact with the heat-dissipation plate (25).
|
