| 摘要 |
PURPOSE: A transparent silicone composition is provided to enable the application for optical semiconductor die bonding requiring an adhesive property, transparency and heat resistance, and to obtain the viscosity and TI(thixotropic index) value suitable for the dispensing and stamping. CONSTITUTION: A transparent silicone composition for optical semiconductor die bonding comprises (a) a silicone resin including a Q-unit, M-unit and D-unit in a unit molecule and selectively T-unit, (b) a solid silicon resin including an alkenyl group bonded to at least two silicon atoms within a unit molecule, (c) a hardener including at least two hydrogens bonded to the silicon atoms, (d) additional reaction catalysts, and (e) alcohols including a carbon-carbon triple bond. |
