| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a wiring pattern which prevents peeling of an insulation film, which starts from a contact hole, from extending. <P>SOLUTION: A wiring metal 2 is provided on a semi-insulating GaAs substrate 1, and a gold plating 4 is provided on the wiring metal 2. The gold plating 4 has a bonding pad part 5 and a wiring part 6. A SiN film 7 is successively provided on the gold plating 4 so as to cover the bonding pad part 5 and the wiring part 6. A contact hole 8 is provided on the SiN film 7 on the bonding pad part 5. A step is provided in the gold plating 4 between the bonding pad part 5 and the wiring part 6. <P>COPYRIGHT: (C)2012,JPO&INPIT |
