| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress variation of etching in a plane of a wiring board when the wiring board is manufactured by etching. <P>SOLUTION: In etching, a substrate 1 is transferred to an etching device in such a state that an intermediate reference body 20 is arranged on the transfer direction side of the substrate 1. At this time, when the distance between a spray 11 and a suction nozzle 12 arranged at first on the transfer direction side to the spray 11 is defined as A, the distance between the suction nozzle 12 and a spray 11 arranged at first on the transfer direction side to the suction nozzle 12 is defined as B, and the sum of the length D of the cut off area 1D of the substrate 1 on the transfer direction side and the length E of the intermediate reference body 20 is defined as C, A+B≤C. <P>COPYRIGHT: (C)2012,JPO&INPIT |
