发明名称 HIGH FREQUENCY MODULE
摘要 <P>PROBLEM TO BE SOLVED: To provide a high frequency module that has a satisfactory transmission characteristic. <P>SOLUTION: A high frequency module 10 includes: a wiring board 50; a DC circuit 51 disposed on the wiring board 50; a high frequency element 30 disposed on the wiring board 50 and having a signal terminal 31 for a high frequency signal, reference potential terminals 32a and 32b connected to a reference potential, and DC terminals 33 used for at least either inputting or outputting a DC signal; a slot structure 20 having a conductor 20b with a slot 20a disposed on an upper surface; a first lead wire 41 connected to the signal terminal 31 and partly crossing over the slot 20a; second lead wires 42 and 43 connected to the reference potential terminals 32a and 32b, at least partly arranged along the first lead wire 41 and disposed so as not to cross over the slot 20a; and connectors 45 connected to the DC terminals 33. The first lead wire 41 and the second lead wires 42 and 43 are electromagnetically coupled to the slot 20a in pairs. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012142693(A) 申请公布日期 2012.07.26
申请号 JP20100292484 申请日期 2010.12.28
申请人 KYOCERA CORP 发明人 HAYATA KAZUKI
分类号 H01P5/107;H01P5/08 主分类号 H01P5/107
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