发明名称 |
ADHESIVE RESIN COMPOSITION AND HOT-MELT ADHESIVE OBTAINED THEREFROM |
摘要 |
[Problem] To provide an adhesive resin composition having improved heat resistance without losing adhesive strength or flexibility. [Solution] The adhesive resin composition comprises 30-98 wt% of an ethylene-vinyl acetate copolymer (a) and 70-2 wt% of the belowmentioned propylene-based resin composition (P) (the total of component (a) and component (P) is 100 wt%). The propylene-based resin composition (P) comprises 60-0 wt% of a propylene polymer (b) having a melting point of 120-170°C and a melt flow rate of 0.1-500 g/10 minutes, and 40-100 wt% of a propylene polymer (c) having a melting point that is less than 120°C or a melting point that is not observed and a melt flow rate of 0.1-500 g/10 minutes (the total of component (b) and component (c) is 100 wt%). |
申请公布号 |
WO2012099107(A1) |
申请公布日期 |
2012.07.26 |
申请号 |
WO2012JP50822 |
申请日期 |
2012.01.17 |
申请人 |
MITSUI CHEMICALS, INC.;YASUI, HIROTO;MATSUNAGA, KOJI |
发明人 |
YASUI, HIROTO;MATSUNAGA, KOJI |
分类号 |
C09J123/08;C09J11/06;C09J11/08;C09J123/10;C09J123/14;C09J123/26;C09J131/04 |
主分类号 |
C09J123/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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