发明名称 ADHESIVE RESIN COMPOSITION AND HOT-MELT ADHESIVE OBTAINED THEREFROM
摘要 [Problem] To provide an adhesive resin composition having improved heat resistance without losing adhesive strength or flexibility. [Solution] The adhesive resin composition comprises 30-98 wt% of an ethylene-vinyl acetate copolymer (a) and 70-2 wt% of the belowmentioned propylene-based resin composition (P) (the total of component (a) and component (P) is 100 wt%). The propylene-based resin composition (P) comprises 60-0 wt% of a propylene polymer (b) having a melting point of 120-170°C and a melt flow rate of 0.1-500 g/10 minutes, and 40-100 wt% of a propylene polymer (c) having a melting point that is less than 120°C or a melting point that is not observed and a melt flow rate of 0.1-500 g/10 minutes (the total of component (b) and component (c) is 100 wt%).
申请公布号 WO2012099107(A1) 申请公布日期 2012.07.26
申请号 WO2012JP50822 申请日期 2012.01.17
申请人 MITSUI CHEMICALS, INC.;YASUI, HIROTO;MATSUNAGA, KOJI 发明人 YASUI, HIROTO;MATSUNAGA, KOJI
分类号 C09J123/08;C09J11/06;C09J11/08;C09J123/10;C09J123/14;C09J123/26;C09J131/04 主分类号 C09J123/08
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