| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board which supports density growth and is provided with a conductor post and provide a manufacturing method thereof. <P>SOLUTION: A manufacturing method of a wiring board having a conductor layer 12, a solder resist layer 13 laminated on the conductor layer 12, and a conductor post 16 conducted to a conductor layer 12a disposed below a through hole 131 provided in the solder resist layer 13 comprises: a through hole boring step of boring the through hole 131 in the solder resist layer 13 containing a thermosetting resin and exposing the conductor layer 12a in the through hole; a first conductor formation step of forming a first conductor part 181 mainly composed of copper in the through hole 131; and a second conductor part formation step of forming a second conductor part 182 mainly composed of tin, copper, or solder on the first conductor part 181 in this order. <P>COPYRIGHT: (C)2012,JPO&INPIT |
