发明名称 FILM FORMATION PATTERN FORMING METHOD AND FILM FORMATION PATTERN FORMING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To efficiently form a wiring pattern or the like to many LED chips loaded on a lead frame with excellent position accuracy by a droplet discharge method. <P>SOLUTION: An entire lead frame 11 loaded with many LED chips 15 is settled inside a visual field of a camera and imaged, and positions of the lead of the lead frame 11 and the respective LED chips 15 are recognized from the picked-up image. On the basis of the recognition result, an inclined plane resin drawing file for specifying a position to form an inclined plane resin pattern 17 inclined downwards from a side face upper end of each LED chip 15 to the lead, a wiring base drawing file for specifying a position to form a wiring base pattern 20 on the inclined plane resin pattern 17, and a wiring drawing file for specifying a position to form a wiring pattern 19 are prepared. By using the drawing files, the inclined plane resin pattern 17, the wiring base pattern 20, and the wiring pattern 19 are formed by a dispenser device or an ink jet device. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012142525(A) 申请公布日期 2012.07.26
申请号 JP20110001239 申请日期 2011.01.06
申请人 FUJI MACH MFG CO LTD 发明人 TSUKADA KENJI
分类号 H01L21/60;H01L33/62 主分类号 H01L21/60
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