| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem that when heat treatment is applied after a plated film which constitutes at least part of an external electrode is formed by letting plating precipitates grow on exposed ends of plural internal electrodes in a component main body, moisture content such as plating liquid in the component main body is removed by evaporation, but the presence of the plated film hinders discharge of moisture content and, more than that, would cause a blister (bulging defect) in the plated film. <P>SOLUTION: Notches 15, 16 for dividing exposed ends 10, 13 into plural portions are formed in lead-out parts 9, 12 of internal electrodes 5, 6. This results in plated films 17, 18 having slits 19, 20 formed therein which extend in a laminated direction at positions of the notches 15, 16. The slits 19, 20 provide a moisture content discharge path which, during heat treatment, helps moisture content go out easily from inside a component main body 2, thereby making it difficult for a blister to form in the plated films 17, 18. <P>COPYRIGHT: (C)2012,JPO&INPIT |
