| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an anisotropic conductive material which, when used for connection between electrodes in a connection structure, facilitates the connection between the electrodes, can enhance conduction reliability and furthermore can enhance heat impact resistant characteristics of the connection structure against thermal shock such as cooling-heating cycle. <P>SOLUTION: The anisotropic conductive material relating to the present invention includes conductive particles 1 and a binder resin. The conductive particle 1 includes a resin particle 2 and a conductive layer 3 covering a surface 2a of the resin particle 2. At least an outside surface layer of the conductive layer 3 is a solder layer 5. The absolute value of the difference between a linear expansion coefficient at 30 to 60°C of the resin particle 2 in the conductive particle 1 and a linear expansion coefficient at 30 to 60°C of a material including all components except the conductive particles 1 in the anisotropic conductive material is 15 ppm/°C or less. <P>COPYRIGHT: (C)2012,JPO&INPIT |
