发明名称
摘要 <p>The present disclosure relates to a wire and a method of forming a wire including an iron based glass forming alloy including iron present in the range of 43.0 to 68.0 atomic percent, boron present in the range of 12.0 to 19.0 atomic percent, nickel present in the range of 15.0 to 17.0 atomic percent, cobalt present in the range of 2.0 to 21.0 atomic percent, optionally carbon present in the range of 0.1 to 6.0 atomic percent and optionally silicon present in the range of 0.4 to 4.0 atomic percent, wherein said wire has a thickness of 140μm or less and wherein said wire includes spinodal glass matrix microconstituents. The wire may be used in abrading a substrate.</p>
申请公布号 JP2012516942(A) 申请公布日期 2012.07.26
申请号 JP20110548419 申请日期 2010.02.03
申请人 发明人
分类号 C22C45/02;B24B27/06 主分类号 C22C45/02
代理机构 代理人
主权项
地址