| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that reduces deformation due to flowing of a sealing resin of a bonding wire connecting a printed board and a lead frame, in a resin-sealed molding of a semiconductor component. <P>SOLUTION: A semiconductor device comprises: semiconductor chips 3 mounted on a substrate 2; lead frames 5 having a channel portion at the inner side; bonding wires 4 connecting the semiconductor chips 3 and the lead frames 5 via the inside of the channel portions; and a resin-hardened material coating the semiconductor chips 3, the bonding wires 4, and the lead frames 5. When the length of the channel portion of each lead frame 5 is L1, the height of the channel portion of each lead frame 5 is H1, the length of each bonding wire 4 in the horizontal direction is L2, and the maximum height of each bonding wire 4 is H2, the following relationships are satisfied: 1/3<L1/L2<1 and 1/2<H1/H2. <P>COPYRIGHT: (C)2012,JPO&INPIT |
