发明名称 SUBSTRATE HEAT TREATMENT APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a substrate heat treatment apparatus which causes little uneven heating on a substrate stage when a substrate is heated in a vacuum. <P>SOLUTION: A substrate heat treatment apparatus includes: a substrate holder unit including a substrate stage on which a substrate is placed; a heating unit which is provided above the substrate stage, includes a heat radiation surface facing the substrate stage, and heats the substrate placed on the substrate stage with radiation heat from the heat radiation surface in non contact manner; a cooling part provided below the substrate stage; and support pillars supporting the substrate stage fixed to the cooling part. Each support pillar is composed of multiple members having different thermal conductivity. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012142333(A) 申请公布日期 2012.07.26
申请号 JP20100292115 申请日期 2010.12.28
申请人 CANON ANELVA CORP 发明人 SHIBAGAKI MASAHATA;MASHITA KAORI;SEKIGUCHI ATSUSHI
分类号 H01L21/324;H01L21/265;H01L21/683 主分类号 H01L21/324
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