| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide conductive particles capable of enhancing conduction reliability when used for connection between electrodes in a connection structure, and to provide an anisotropic conductive material using the conductive particles. <P>SOLUTION: A conductive particle 1 relating to the present invention includes: a base material particle 2; a first conductive layer 4 which is disposed on a surface 2a of the base material particle 2 and has projections 4b on a surface 4a of the outside thereof; and a solder layer 5 disposed on the surface 4a of the outside of the first conductive layer 4. The anisotropic conductive material relating to the present invention includes the conductive particles 1 and a binder resin. <P>COPYRIGHT: (C)2012,JPO&INPIT |
