发明名称 |
COOLING DEVICE FOR AN INTEGRATED CIRCUIT |
摘要 |
A pump having: a cavity formed inside an insulating substrate, the upper part of the substrate being situated near the cavity having an edge; a conductive layer covering the inside of the cavity up to the edge and optionally covering the edge itself; a flexible membrane made of a conductive material placed above the cavity and resting against the edge; a dielectric layer covering the conductive layer or the membrane whereby insulating the portions of the conductive layer and of the membrane that are near one another; at least one aeration line formed in the insulating substrate that opens into the cavity via an opening in the conductive layer, and; terminals for applying a voltage between the conductive layer and the membrane.
|
申请公布号 |
US2012187519(A1) |
申请公布日期 |
2012.07.26 |
申请号 |
US201213436583 |
申请日期 |
2012.03.30 |
申请人 |
BOUCHE GUILLAUME;STMICROELECTRONICS S.A. |
发明人 |
BOUCHE GUILLAUME |
分类号 |
H01L29/66;B81B3/00;F04B43/04;F15C5/00;H01L21/306 |
主分类号 |
H01L29/66 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|