CIRCUIT PATTERN INSPECTION DEVICE AND INSPECTION METHOD THEREFOR

摘要

Provided is a high-speed circuit pattern inspection scheme requiring a short inspection preparation time and capable of defect assessment by detecting an image of only one die, and also provided is a device therefor. With reference to design information, coordinates expected to have the same pattern as specific coordinates, and alignment coordinates are selected. By aligning the detected image and the design information at the alignment coordinates to correct the misalignment, and comparing with the pattern for the coordinates expected to have the same pattern, pattern comparison is possible even by detecting an image of only one die.