| 摘要 |
<P>PROBLEM TO BE SOLVED: To efficiently radiate heat generated in semiconductor light-emitting elements. <P>SOLUTION: A lamp is provided with a case 110, and a substrate 310 with an LED 321 mounted. The case 110 is structured of a first case 200 and a second case 400. The substrate 310 is loaded on a second case 400. The second case 400 is made of a long plastically deformed metal plate and structured of a material having larger thermal conductivity than that of the substrate 310. <P>COPYRIGHT: (C)2012,JPO&INPIT |
