| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide processing equipment in which an in-plane temperature distribution at a wafer support is appropriately formed. <P>SOLUTION: The processing equipment includes: a processing chamber 10; a support 22 for a wafer W, provided in the processing chamber; a heater h for heating the support; and a shower plate 12 provided to face the support and having a plurality of gas blow-out holes 14 communicating with the processing chamber. A surface facing the support in the shower plate includes a plurality of regions where reflectances with respect to radiation heat from a side of the support are relatively different. <P>COPYRIGHT: (C)2012,JPO&INPIT |
