| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polyimide precursor solution for producing a heat-resistant polyimide coating membrane (film) for film devices and excellent in heat resistance. <P>SOLUTION: The polyimide precursor solution is characterized in that a polyimide precursor solution is a polyamic acid solution containing a solvent and a polyamide obtained from an aromatic tetracarboxylic acid anhydride, a dicarboxylic acid anhydride, and a diamine having a benzazole skeleton as main components, and the equivalents An of carboxylic acid anhydride groups possessed by the aromatic tetracarboxylic acid anhydride, the equivalent Bn of carboxylic acid anhydride groups possessed by the dicarboxylic acid anhydride, and the equivalent Cn of amino groups possessed by the diamine simultaneously satisfy relation expressions (1) and (2): 1<Cn/(An+Bn)≤1.1 (1), 0≤Bn/An≤0.2 (2). <P>COPYRIGHT: (C)2012,JPO&INPIT |
