| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a base material for film formation, which can increase a deposition rate while preventing lowering of adhesion of a polyimide coating film in vapor-deposition polymerization. <P>SOLUTION: The method for manufacturing the base material for film formation includes a first step and a second step. In the first step, a temperature T in a deposition chamber 20 is set to a first temperature (220°C) which is lower than a predetermined oxidization reference temperature (250°C) of a base material 10, and a pressure P in the chamber is set to a first pressure (15 Pa) at which raw material monomers 31 and 41 are vaporized at the first temperature, and then an oxidization preventive polyimide coating film 11a is formed on the surface of the base material 10. In the second step, the number of molecules of the raw material monomers 31 and 41 is increased in the deposition chamber 20 and the pressure P in the chamber is set to a second pressure (90 Pa) which is higher than the first pressure, the temperature T in the chamber is set to a second temperature (300°C) which is higher than the oxidization reference temperature and at which the respective raw material monomers 31 and 41 are vaporized at the second pressure, and then a polyimide coating film 11b for forming a thick film is formed on the surface of the oxidization preventive coating film 11a. <P>COPYRIGHT: (C)2012,JPO&INPIT |
