PHOTOSENSITIVE RESIN COMPOSITION, AND PHOTOSENSITIVE MATERIAL COMPRISING SAME

摘要

The present invention relates to a photosensitive resin composition and to a photosensitive material comprising same. The photosensitive resin composition according to the present invention may comprise two types of polyfunctional monomers with different compositional ratios, in which the side chains of the monomers have different structures and respectively contain an unsaturated double bond. The photosensitive resin composition according to the present invention has superior processability and improves adhesion to a lower substrate after a hard-baking process, thus reducing defects caused by a burst during the sealing of an LCD substrate as well as substrate-separation defects caused by an impact applied to a completed LCD product.