发明名称 ELECTRONIC COMPONENT MOUNTING APPARATUS AND ELECTRONIC COMPONENT MOUNTING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus and an electronic component mounting method that implement a reliable operation of loading a new tape onto a feeder upon component exhaustion when, for example, a model of printed boards is changed and a component supply apparatus is replaced, or implement a high operation rate by shortening a setup time. <P>SOLUTION: The electronic component mounting apparatus or electronic component mounting method for feeding a supply tape storing electronic components in a plurality of storage portions lined at predetermined intervals to sequentially move the storage portions to a component pickup port for electronic component pickup, picking up the electronic components through the component pickup port, and mounting them on printed boards employs a height measurement sensor for measuring an internal height of the storage portions moved to the component pickup port. Additionally, the supply tape is cued according to the result of measurement. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012142347(A) 申请公布日期 2012.07.26
申请号 JP20100292411 申请日期 2010.12.28
申请人 HITACHI HIGH-TECH INSTRUMENTS CO LTD 发明人 ONISHI SEIJI;OYAMA KAZUYOSHI;MATSUYOSHI TSUTOMU
分类号 H05K13/04;H05K13/08 主分类号 H05K13/04
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