| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent cracks, burrs and delamination from occurring in deposited films on a wafer that is placed upside down by positioning a deposition surface downward. <P>SOLUTION: In a vapor deposition apparatus, a fixing jig 3 for mounting a wafer mounts the wafer 2 by receiving the wafer from down side while supporting the wafer. The fixing jig includes an eave-like step 3a formed in a ring shape in a planar view, at an inner peripheral end of the fixing jig 3. The wafer 2 is mounted on a ring-like step 3b of the fixing jig 3, and also a lid 4 whose lower surface abuts on an upper surface of the wafer 2 to fix the wafer by its own weight, is mounted on a step 3c located on an outer peripheral side of the fixing jig 3. The lower surface of the lid 4 mounted on the step 3c has the step height relation between the steps 3b and 3c slightly pressing the upper surface of the wafer 2 mounted on the step 3b. <P>COPYRIGHT: (C)2012,JPO&INPIT |
