| 摘要 |
The present invention relates to a leveling apparatus, methods of using the leveling apparatus, and kits that include the leveling apparatus. The leveling apparatus is useful in various applications, including, without limitation, those applications that involve positioning a planar object (e.g., a wall stencil) against a substantially vertical surface (e.g., a wall) at a desired angle relative to horizontal (e.g., relative to the floor or ceiling). |
