WIRING SUBSTRATE HAVING BUILT-IN COMPONENT

摘要

Provided is a wiring substrate having a built-in component, with which defects such as cracks caused by the concentration of stress at corners can be prevented when a component is incorporated in an accommodating section of a core material with a resin filler interposed. The wiring substrate having a built-in component of the present invention comprises: a core material (11) which is formed with an open accommodating section; a component (capacitor) (50) which is accommodated in the accommodating section of the core material (11); and a laminated section which is formed by alternately laminating an insulating layer and a conductive layer on the core material (11). A resin filler (20) is used to fill the gap (G) between the accommodating section of the core material (11) and the component (50). In corner regions (C), at the inner peripheral section of the accommodating section of the core material (11), a linear first chamfered section is formed at each corner of a rectangle, and at the outer peripheral section of the component (50), a linear second chamfered section is formed at each corner of the rectangle. The length of the chamfering of the second chamfered section is greater than the width of the gap in the corner regions (C). By means of this construction, the concentration of stress in the vicinity of the corners of the resin filler (20) is mitigated, making it possible to guarantee high reliability by preventing cracking or the like.