BUMPS FOR LIGHT EMITTING DEVICE AND FABRICATION METHOD THEREOF

摘要

PURPOSE: Bumps for light emitting device and fabrication method thereof are provided to reduce processing steps and costs by directly forming bumps with a UBM layer on a metal pad of an emitting element including Ti group metal materials. CONSTITUTION: An emitting element (110) where a transparent substrate (111), first semiconductor layer (112), active layer (113), and second semiconductor layer (114) are includes electrode pads (115,116,117) including Ti group metal materials. A passivation layer(120) is formed to expose an electrode pad on the emitting element. A bump(130) which is either a shoulder or cupper pillar bump is formed on the exposed electrode pad through the passivation layer.