| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which inhibits occurrence of poor electrical connection. <P>SOLUTION: A semiconductor device comprises a mold IC (10), a housing (20), a terminal (30) and a potting agent (40). The mold IC (10) is fixed to an inner surface of a bottom (21) of the housing (20). A connection part (31a) electrically connecting a lead (11) of the mold IC (10) with a projecting part (31) of the terminal (30), projecting into housing space of the housing (20) is covered with the potting agent (40) which fills a part of the housing space. A low stress part (50) composed of a material having a linear expansion coefficient and Young's modulus at least one of which is lower than that of the potting agent (40) is provided between the bottom (21) and the projecting part (31). <P>COPYRIGHT: (C)2012,JPO&INPIT |
