| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device having a structure which allows conductor members serving as electrodes to be easily exposed on a main surface of a semiconductor module. <P>SOLUTION: A semiconductor device is manufactured by respectively soldering a first conductor member 3 and a second conductor member 5 to an element formation surface 1a and a back surface 1b of a semiconductor chip 1 and resin-sealing the first conductor member and the second conductor member with a sealing member 9. The first conductor member has a spring structure 3c which expands and contracts in a lamination direction 51 of the semiconductor chip and the like. <P>COPYRIGHT: (C)2012,JPO&INPIT |
