发明名称 CIRCUIT SUBSTRATE ASSEMBLY, SUBSTRATE DEVICE, AND ASSEMBLING METHOD OF CIRCUIT SUBSTRATE ASSEMBLY
摘要 <P>PROBLEM TO BE SOLVED: To provide a circuit substrate assembly capable of further improving the position accuracy of a terminal, a substrate device, and an assembling method of the circuit substrate assembly. <P>SOLUTION: A contact 25 pressed in a holding hole 22 of a housing 21 is held by a press-in holding portion 40 formed on the holding hole 22. By friction generated between a contact press-in portion 42 of the pre-in holding portion 40 and a pressed-in portion 50 of the contact 25, the contact 25 is fixed to the contact press-in portion 42, thereby preventing the contact 25 from coming off from the holding hole 22, and preventing the pressed in contact 25 from shifting in a direction (a Z-direction) continuing to the holding hole 22 and directions (a Y-direction, and an X-direction) orthogonal to the holding hole 22. Furthermore, the contact 25 is pressed in the holding hole 22 from a surface 23a side of a contact holding plate 23 on which one end 25a inserted in a through-hole 31 of a circuit substrate 30 is positioned. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012142152(A) 申请公布日期 2012.07.26
申请号 JP20100293155 申请日期 2010.12.28
申请人 TYCO ELECTRONICS JAPAN KK 发明人 SHINDO MASAHIKO
分类号 H01R13/41;H01R12/71;H01R12/77;H01R43/20 主分类号 H01R13/41
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