发明名称 |
LAMINATED ANTENNA STRUCTURES FOR PACKAGE APPLICATIONS |
摘要 |
Apparatus and methods for packaging IC chips and laminated antenna structures with laminated waveguide structures that are integrally constructed as part of an antenna package to form compact integrated radio/wireless communications systems for millimeter wave applications.
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申请公布号 |
US2012188138(A1) |
申请公布日期 |
2012.07.26 |
申请号 |
US201113011441 |
申请日期 |
2011.01.21 |
申请人 |
LIU DUIXIAN;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
LIU DUIXIAN |
分类号 |
H01Q13/00;H01Q21/00 |
主分类号 |
H01Q13/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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