发明名称 |
SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR SUBSTRATE BONDING METHOD |
摘要 |
According to one embodiment, semiconductor manufacturing apparatus includes a first member that holds a first semiconductor substrate; a second member that holds a second semiconductor substrate in a state where a bonding surface of the second semiconductor substrate faces a bonding surface of the first semiconductor substrate; a distance detecting unit that detects a distance between the bonding surface of the first semiconductor substrate and the bonding surface of the second semiconductor substrate; an adjusting unit that adjusts the distance between the bonding surface of the first semiconductor substrate and the bonding surface of the second semiconductor substrate to a predetermined value by moving at least one of the first and second members based on a detection result of the distance detecting unit; and a third member that forms the bonding start point between the first semiconductor substrate and the second semiconductor substrate. |
申请公布号 |
US2012190138(A1) |
申请公布日期 |
2012.07.26 |
申请号 |
US201213354734 |
申请日期 |
2012.01.20 |
申请人 |
TANIDA KAZUMASA;HONGO SATOSHI;YAMAGUCHI NAOKO;TAKAHASHI KENJI;NUMATA HIDEO;KABUSHIKI KAISHA TOSHIBA |
发明人 |
TANIDA KAZUMASA;HONGO SATOSHI;YAMAGUCHI NAOKO;TAKAHASHI KENJI;NUMATA HIDEO |
分类号 |
H01L21/66;B32B37/30;B32B41/00 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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