发明名称 HIGH IMPEDANCE ELECTRICAL CONNECTION VIA
摘要 <p>Vias for differential signals are typically of a lower impedance than the signal lines connected to them. The noise and reflected signals resulting in impedance mismatch may require circuits to be operated at a frequency far lower than desired. One or more embodiments of the present invention avoid impedance mismatch in circuits and achieve an advance in the art by providing a via with higher impedance through the addition of split ring resonators (SSRs) to each end of the via.</p>
申请公布号 KR20120083460(A) 申请公布日期 2012.07.25
申请号 KR20127012540 申请日期 2010.07.15
申请人 XILINX, INC. 发明人 WYLAND CHRISTOPHER P.
分类号 H01L23/66;H01L23/64 主分类号 H01L23/66
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