| 摘要 |
<p>The present invention provides a removal roller (12) for detaching a film (2) from a disc-shaped workpiece (3), in particular from a mould wafer (3), comprising a film handling portion (13) for non-positively taking up or for expelling a portion (14) of the film (2). The present invention also provides a device (1) for detaching a film (2) from a disc-shaped workpiece (3), in particular from a mould wafer (3), comprising: a mounting means (4) for non-positively mounting the disc-shaped workpiece (3); a removal roller (12) of this type; a displacement means (17) for moving the removal roller (12) horizontally and/or vertically to a surface (10) of the mounting means (4); and a rotation means (24) for rotating the removal roller (12) about a centre axis (25) of the removal roller (12). Furthermore, the present invention also provides a method for detaching a film (2) from a disc-shaped workpiece (3), in particular from a mould wafer (3), by means of a device (1) of this type.</p> |
