摘要 |
Provided is a light emitting device. The light emitting device includes a plurality of metal layers including first (111) and second (113) metal layers spaced from each other, a first insulation film (121) disposed on a top surface of the plurality of metal layers, the first insulation film having a width (W1) wider than a distance between the plurality of metal layers, a light emitting chip (145) disposed on the first metal layer of the plurality of metal layers, and a resin layer (161) disposed on the first metal layer, the first insulation film, and the light emitting chip. The first metal layer includes a first base part dispose on the light emitting chip and a first side part bent from the first base part on an outer portion of the first base part. |