| 摘要 |
PURPOSE: A lead frame and a manufacturing method thereof are provided to improve adhesion between a completed package and a PCB by thickening the lower thickness of a bump than the upper thickness of the bump. CONSTITUTION: A bump is formed on the side of an insulation unit. A first metal unit(195b) is formed on the bump. A lead unit(165a) is formed on the insulation unit and is connected to the first metal unit. An inner lead(180a) is plated on the upper side of the lead unit which is adjacent to a die pad unit. An outer lead(180b) is formed on the lower side of the bump. |
