| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition used as a die attach paste for semiconductors, or an adhering material for heat radiating members which has especially a low elastic modulus and excels in its stress relaxing property and its adhesiveness; and to provide an electronic apparatus created by using it which excels especially in the reliability of a reflow resistance, etc. SOLUTION: The resin composition is the one for adhering a semiconductor element or a heat radiating member to a supporter, and contains a compound (A), a polymerization initiating agent (B), and a silver powder (C). Hereupon, the compound (A) is represented by a formula (1) (in the formula, R<SP>1</SP>is hydrogen or a methyl group, and R<SP>2</SP>is a hydrocarbon group having the carbon number of three to ten and contains no aromatic compound, and further, n is an integer of one to fifty). The semiconductor device is created by using this resin composition. COPYRIGHT: (C)2007,JPO&INPIT |
