发明名称 Process for forming a ferroelectric film
摘要 <p>Such that at least 5 mol% of donor ions are doped at an A site, a ferroelectric film (40) containing a perovskite type oxide of Formula (P) is formed on a substrate (B) facing a target (T) by sputtering under conditions of a height of a shield (250), which surrounds an outer periphery of the target (T) on the substrate side in a non-contact state and comprises shielding layers (250a, 250a, ...) superposed at intervals, such that a difference between a plasma potential and a floating potential is at most 35V, and under conditions of a substrate temperature of at least 400°C: €ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ (Ph 1-x+´ M x ) (Zr y Ti 1-y )O-€ƒ€ƒ€ƒ€ƒ€ƒ(P) wherein M represents at least one kind of element selected from Bi and lanthanide elements, 0. 05 ‰¤ x ‰¤ 0. 4, and 0 < y ‰¤ 0.7, the standard composition being such that ´=0, and z=3.</p>
申请公布号 EP2034041(B1) 申请公布日期 2012.07.25
申请号 EP20080015564 申请日期 2008.09.03
申请人 FUJIFILM CORPORATION 发明人 ARAKAWA, TAKAMI;FUJII, TAKAMICHI
分类号 C23C14/08;B41J2/045;B41J2/055;B41J2/135;B41J2/14;B41J2/145;B41J2/155;B41J2/16;C01G23/00;C01G25/00;C04B35/491;C23C14/34;H01L21/316;H01L41/09;H01L41/18;H01L41/187;H01L41/316;H01L41/39 主分类号 C23C14/08
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