发明名称 |
SUBSTRATE TRANSFER MECHANISM WITH PREHEATING FEATURES |
摘要 |
<p>Embodiments of the present invention provide apparatus and method for heating one or more substrates during transfer. One embodiment provides a robot blade assembly for supporting a substrate or a substrate carrier thereon. The robot blade assembly comprises a base plate, an induction heating assembly disposed on the base plate, and a top plate disposed above the induction heating assembly. Another embodiment provides an induction heating assembly disposed over a transfer chamber having a substrate transfer mechanism disposed therein.</p> |
申请公布号 |
KR20120083369(A) |
申请公布日期 |
2012.07.25 |
申请号 |
KR20127008324 |
申请日期 |
2010.09.16 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
ISHIKAWA TETSUYA;PANG LILY L.;PHAM QUYEN D.;OLGADO DONALD J.K. |
分类号 |
H01L21/677;B25J15/00;B65G49/07;H05B3/02 |
主分类号 |
H01L21/677 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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