发明名称 SUBSTRATE TRANSFER MECHANISM WITH PREHEATING FEATURES
摘要 <p>Embodiments of the present invention provide apparatus and method for heating one or more substrates during transfer. One embodiment provides a robot blade assembly for supporting a substrate or a substrate carrier thereon. The robot blade assembly comprises a base plate, an induction heating assembly disposed on the base plate, and a top plate disposed above the induction heating assembly. Another embodiment provides an induction heating assembly disposed over a transfer chamber having a substrate transfer mechanism disposed therein.</p>
申请公布号 KR20120083369(A) 申请公布日期 2012.07.25
申请号 KR20127008324 申请日期 2010.09.16
申请人 APPLIED MATERIALS, INC. 发明人 ISHIKAWA TETSUYA;PANG LILY L.;PHAM QUYEN D.;OLGADO DONALD J.K.
分类号 H01L21/677;B25J15/00;B65G49/07;H05B3/02 主分类号 H01L21/677
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