METHOD FOR MANUFACTURING AN ENCAPSULANT FOR LED PACKAGE, AND ENCAPSULANT

摘要

PURPOSE: A manufacturing method of an encapsulating material for LED package is provided to effectively prevent agglomeration phenomenon of the phosphor powder by providing the fluorescent substance dipped in the mica type silicate. CONSTITUTION: A manufacturing method of an encapsulating material for LED package comprises the following steps: preparing mica type silicate powder(10); mixing the powder with an aqueous solution having 1-0.2 mole divalent metals(30); mixing phosphor powders(50) with the aqueous solution; manufacturing mica type silicate powder in which the fluorescent substance is dipped; and packaging as the encapsulating material by mixing the mica type silicate powder with the silicon.