发明名称 |
Integrated circuit packaging system with encapsulant containment and method of manufacture thereof |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; forming layers having non-horizontal strip patterns and non-vertical strip patterns over the substrate; mounting an integrated circuit device on the substrate adjacent the non-horizontal strip patterns and the non-vertical strip patterns; and applying an encapsulation over the integrated circuit device, the encapsulation restricted by the layers to prevent the encapsulation from reaching an edge of the substrate. |
申请公布号 |
US8227903(B2) |
申请公布日期 |
2012.07.24 |
申请号 |
US20100882856 |
申请日期 |
2010.09.15 |
申请人 |
LEE HYE RAN;LEE TAE KEUN;KIM JAEPIL;SEO JUNGHO;STATS CHIPPAC LTD |
发明人 |
LEE HYE RAN;LEE TAE KEUN;KIM JAEPIL;SEO JUNGHO |
分类号 |
H01L23/552 |
主分类号 |
H01L23/552 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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