PATTERNABLE ADHESIVE COMPOSITION, SEMI-CONDUCTIVE PACKAGE USING THE SAME, AND METHOD OF PREPARING SEMI-CONDUCTIVE PACKAGE

摘要

PURPOSE: A pattern-formable adhesive composition, semiconductor package using the same and a manufacturing method thereof are provided to improve heat resistance at high temperature and pattern formation properties. CONSTITUTION: A pattern-formable adhesive composition comprises alkali developable resin having one kind or a plurality of alkali-developable groups and acryloyl, one kind or a plurality of radically polymerizable compounds, one kind or a plurality of thermosetting resins, and one kind or a plurality of photo radical initiators. The alkali developable resin comprises one or more polymers having an average molecular weight of 5-30 k and a glass transition temperature of 100 deg. Celsius or greater. The one kind or a plurality of alkali developable resins has an acid value of 30-100 mgKOH/g. The total acid value of the composition is 40-60 mgKOH/g.