发明名称 |
Semiconductor device and manufacturing method thereof, and camera module including the same |
摘要 |
A semiconductor device includes: an insulating base; a semiconductor element provided on the insulating base; a protector provided on the semiconductor element; and a frame provided on a periphery of the insulating base and surrounding the semiconductor element. A region inside the frame is filled with a sealing resin, and at least one groove is provided in an upper corner portion of the frame on the semiconductor element side of the frame.
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申请公布号 |
US8227814(B2) |
申请公布日期 |
2012.07.24 |
申请号 |
US201113117803 |
申请日期 |
2011.05.27 |
申请人 |
PANASONIC CORPORATION |
发明人 |
TANAKA SHOICHI;OHSAKI HIROTO |
分类号 |
H01L27/15;H01L23/28;H01L27/14;H01L29/267;H01L31/12 |
主分类号 |
H01L27/15 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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