发明名称 Mask pattern correction device, method of correcting mask pattern, light exposure correction device, and method of correcting light exposure
摘要 In view of realizing a lithographic process which makes it possible to estimate and correct flare with an extremely high accuracy, and causes only an extremely small dimensional variation in width, over the entire portion not only of a single shot region, but also of a single chip region, a mask pattern correction device of the present invention has a numerical aperture calculation unit calculating, for every single shot region, flare energy for a mask pattern corresponding to a transferred pattern, based on an exposure layout of a plurality of shot regions, or more specifically, while considering flare from a plurality of shot regions located around every single shot region.
申请公布号 US8227153(B2) 申请公布日期 2012.07.24
申请号 US20100767602 申请日期 2010.04.26
申请人 YAO TERUYOSHI;ASAI SATORU;OSAWA MORIMI;HOSHINO HIROMI;OGINO KOUZOU;MORISHITA KAZUMASA;FUJITSU SEMICONDUCTOR LIMITED 发明人 YAO TERUYOSHI;ASAI SATORU;OSAWA MORIMI;HOSHINO HIROMI;OGINO KOUZOU;MORISHITA KAZUMASA
分类号 G03F1/70;G03F1/36;G03F1/38;G03F1/68;H01L21/027 主分类号 G03F1/70
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