发明名称 |
Multilayered circuit board and semiconductor device |
摘要 |
A multilayered circuit board of the present invention has a single-side laminated structure and does not include a core substrate having via-holes formed therethrough and vias for providing electrical connection through the via-holes. The multilayered circuit board includes a plurality of pairs of layers, each pair including a conductor circuit layer and an insulator layer, wherein a glass transition temperature of each insulator layer is 170° C. or higher, a coefficient of thermal expansion at the glass transition temperature or lower of each insulator layer is 35 ppm or less, and a modulus of elasticity of each insulator layer is 5 GPa or more. |
申请公布号 |
US8227703(B2) |
申请公布日期 |
2012.07.24 |
申请号 |
US20080593749 |
申请日期 |
2008.01.17 |
申请人 |
MARUYAMA HIRONORI;NAKAMURA KENSUKE;MEURA TORU;HIROSE HIROSHI;SUMITOMO BAKELITE COMPANY, LTD. |
发明人 |
MARUYAMA HIRONORI;NAKAMURA KENSUKE;MEURA TORU;HIROSE HIROSHI |
分类号 |
H05K1/03 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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