发明名称 |
Wiring structure of printed wiring board and method for manufacturing the same |
摘要 |
Provided is a wiring structure and the like which can completely connect a wiring layer to a body to be wired while keeping insulation between two adjacent wiring layers and realize high density packaging due to a narrowed pitch. In a semiconductor-embedded substrate, a conductive pattern is formed on both sides of a core substrate and a semiconductor device is placed in a resin layer stacked over the core substrate. The resin layer has via-holes so that the conductive pattern and a bump of the semiconductor device protrude from the resin layer. Inside the via-holes, the bump and conductive pattern are respectively connected to via-hole electrode portions whose cross-sectional area has been increased toward the bottom of the via-hole. A void is defined between the via-hole electrode portion and upper portion of the inner wall of the via-hole. |
申请公布号 |
US8227710(B2) |
申请公布日期 |
2012.07.24 |
申请号 |
US20070987255 |
申请日期 |
2007.11.28 |
申请人 |
NAGASE KENJI;KAWABATA KENICHI;TDK CORPORATION |
发明人 |
NAGASE KENJI;KAWABATA KENICHI |
分类号 |
H05K1/11 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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