Image sensor having bond pads arranged relative to read-out circuit

摘要

The invention relates to an image sensor for electronic cameras, comprising a plurality of light-sensitive pixels for the generation of signals proportional to exposure and at least one read-out circuit coupled to the pixels and having a first section and a second section disposed downstream of the first section in a signal read-out direction, wherein the first section and the second section of the read-out circuit are each connected to at least one bond pad provided for the supply of an operating voltage and/or to at least one bond pad provided for the supply of a reference potential. At least some of the bond pads provided for the supply of the operating voltage and/or of the reference potential to the read-out circuit are arranged between the first section and the second sections of the read-out circuit.